Taifu Lang
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View article: A simplified and high yield method for Micro-LED integration: Substitution of metal bumps with conductive photoresist in high-precision mass transfer
A simplified and high yield method for Micro-LED integration: Substitution of metal bumps with conductive photoresist in high-precision mass transfer Open
View article: High-Yield and High-Accuracy Mass Transfer of Full-Color Micro-LEDs Using a Blister-Type Dynamic Release Polymer
High-Yield and High-Accuracy Mass Transfer of Full-Color Micro-LEDs Using a Blister-Type Dynamic Release Polymer Open
Micro light-emitting diode (Micro-LED) is widely regarded as a highly promising technology in the current display field due to its excellent performance, but the core issue hindering the further development of Micro-LED is how to achieve h…
View article: Bump-Fabrication Technologies for Micro-LED Display: A Review
Bump-Fabrication Technologies for Micro-LED Display: A Review Open
Micro Light Emitting Diode (Micro-LED) technology, characterized by exceptional brightness, low power consumption, fast response, and long lifespan, holds significant potential for next-generation displays, yet its commercialization hinges…
View article: Realization of highly c-axis oriented AlN textured films on wafer-level polycrystalline Mo substrate via magnetron sputtering
Realization of highly c-axis oriented AlN textured films on wafer-level polycrystalline Mo substrate via magnetron sputtering Open
View article: Thin‐Film Assisted Laser Transfer and Bonding (TFA‐LTAB) for the Fabrication of Micro‐LED Displays
Thin‐Film Assisted Laser Transfer and Bonding (TFA‐LTAB) for the Fabrication of Micro‐LED Displays Open
Micro‐Light Emitting Diodes (Micro‐LEDs) are key components in the field of next‐generation display technologies. In the process of making Micro‐LED displays, millions of chips need to be transferred to the driver substrate using mass tran…
View article: High-yield Micro-LED laser transfer accomplished using an ablation-type release material
High-yield Micro-LED laser transfer accomplished using an ablation-type release material Open
Micro light-emitting diode (Micro-LED) is a highly promising technology in the field of new displays, with the mass transfer process involved in its manufacturing process widely regarded as a major barrier to their further development. Thi…
View article: Electroless deposition of nickel microbumps for fine-pith flip-chip bonding
Electroless deposition of nickel microbumps for fine-pith flip-chip bonding Open
The reliability of micro-light-emitting diode (Micro-LED) is closely associated with the uniformity of microbumps arrays. With continual decreases in pixel pitch in recent years, it is a challenge to guarantee the uniformity of bump arrays…
View article: Realizing a Residue-Free Polymer Based Ultrahigh Yield Laser Transfer of Micro-Led Display Pixels Using Data Grouping and Empirical Formula
Realizing a Residue-Free Polymer Based Ultrahigh Yield Laser Transfer of Micro-Led Display Pixels Using Data Grouping and Empirical Formula Open