Takafumi Fukushima
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View article: Die-Level Transformation From 2D Shuttle Chips to 3D-IC With TSV for Advanced Rapid Prototyping Methodology With Meta Bonding
Die-Level Transformation From 2D Shuttle Chips to 3D-IC With TSV for Advanced Rapid Prototyping Methodology With Meta Bonding Open
View article: Robotic urologic applications of the hinotori™ Surgical Robot System
Robotic urologic applications of the hinotori™ Surgical Robot System Open
View article: Bendability enhancement of 3D interconnections with out-of-plane corrugation for flexible hybrid electronics
Bendability enhancement of 3D interconnections with out-of-plane corrugation for flexible hybrid electronics Open
This study focuses on enhancing the bendability of flexible interconnects with out-of-plane corrugation for flexible hybrid electronics. We propose two typical configurations of 3D corrugated interconnects: serpentine and trapezoidal. Thre…
View article: Development of Battery Self-Traction System forN700S Shinkansen High-Speed Train
Development of Battery Self-Traction System forN700S Shinkansen High-Speed Train Open
This paper presents the development of a novel lithium-ion battery self-traction system for emergency such as power failures of the catenary.The system will be introduced in the new Shinkansen train "N700S," which will enter the commercial…
View article: An Electronic Microsaccade Circuit with Charge-Balanced Stimulation and Flicker Vision Prevention for an Artificial Eyeball System
An Electronic Microsaccade Circuit with Charge-Balanced Stimulation and Flicker Vision Prevention for an Artificial Eyeball System Open
This paper presents the first circuit that enables microsaccade function in an artificial eyeball system. Currently, the artificial eyeball is receiving increasing development in vision restoration. The main challenge is that the human eye…
View article: 3D-stacked retinal prosthesis chip with binary image capture and edge detection functions for human visual restoration
3D-stacked retinal prosthesis chip with binary image capture and edge detection functions for human visual restoration Open
Retinal prosthesis is a promising treatment for vision degeneration. However, clinical experiments show that the patients can only recognize several grayscales at low resolution with electrical stimulation. This paper proposes a retinal pr…
View article: Successful treatment of BK virus‐associated severe hemorrhagic cystitis with bilateral single‐J ureteral stenting
Successful treatment of BK virus‐associated severe hemorrhagic cystitis with bilateral single‐J ureteral stenting Open
Introduction BK virus‐associated hemorrhagic cystitis is a significant complication of hematopoietic stem cell transplantation. Although severe BK virus‐associated hemorrhagic cystitis is associated with treatment‐related mortality, suffic…
View article: POSTOPERATIVE RECURRENCE OF RENAL CELL CARCINOMA AFTER THE LAPAROSCOPIC PARTIAL NEPHRECTOMY
POSTOPERATIVE RECURRENCE OF RENAL CELL CARCINOMA AFTER THE LAPAROSCOPIC PARTIAL NEPHRECTOMY Open
(Objectives)The usefulness of partial nephrectomy for renal tumors has been highlighted in various guidelines. Since 2006, we have been actively performing laparoscopic partial nephrectomy for renal tumors. We investigated the postoperativ…
View article: Outstanding Technical Features of Traction System in N700S Shinkansen New Generation Standardized High Speed Train
Outstanding Technical Features of Traction System in N700S Shinkansen New Generation Standardized High Speed Train Open
This paper overviews a traction system for Tokaido Shinkansen trains and presents a novel silicon carbide (SiC)-applied traction system of the new generation Shinkansen train, "N700S", which began commercial service in the summer of 2020. …
View article: <scp>On‐wafer</scp> thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for <scp>through‐silicon</scp> via applications: Comparison to <scp>plasma‐enhanced</scp> chemical vapor deposition <scp>SiO<sub>2</sub></scp>
<span>On‐wafer</span> thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for <span>through‐silicon</span> via applications: Comparison to <span>plasma‐enhanced</span> chemical vapor deposition <span>SiO<sub>2</sub></span> Open
Thin‐film polyimides were prepared by solvent‐less vapor deposition polymerization (VDP) from pyromellitic dianhydride and 4,4′‐oxydianiline at 200 °C for liner dielectric formation of vertical interconnects called through‐silicon vias (TS…
View article: Development of SiC Applied Traction System for Next-Generation Shinkansen High-Speed Trains
Development of SiC Applied Traction System for Next-Generation Shinkansen High-Speed Trains Open
This paper presents the development of a traction system for high-speed trains by adopting SiC power devices to pursue weight reduction and compactness of the system. We found that the combination of the SiC applied conversion system with …
View article: Directed Self-Assembly based Interconnect Technology for Next-Generation 2D/3D LSI
Directed Self-Assembly based Interconnect Technology for Next-Generation 2D/3D LSI Open
Three-dimensional integrated circuits (3D ICs) contain multiple layers of active device chiplets and have the potential to improve signal transfer and the overall performance of a microelectronic systems, while saving energy. Dr Takafumi F…
View article: A case report of unilocular cystic mucinous tubular and spindle cell carcinoma with mural tumor nodule
A case report of unilocular cystic mucinous tubular and spindle cell carcinoma with mural tumor nodule Open
View article: Battery Self-Traction System for High Speed Train
Battery Self-Traction System for High Speed Train Open
In N700S Shinkansen rolling stock, we achieved weight reduction of the traction system that contributes to make space for new equipment under the floor of the car body. By using the created space, a self-traction battery system was develop…
View article: Development of Traction System for Shinkansen High-Speed Rolling Stock, N700S
Development of Traction System for Shinkansen High-Speed Rolling Stock, N700S Open
In this study, we developed a traction system for high-speed trains by adopting SiC power devices to pursue weight reduction and compactness of the system. We found the combination of the SiC applied conversion system with train-draft cool…
View article: Study on the behavior of combine harvester during slope traveling.
Study on the behavior of combine harvester during slope traveling. Open
View article: Study of Al-doped ZnO Transparent Stimulus Electrode for Fully Implantable Retinal Prosthesis with Three-dimensionally Stacked Retinal Prosthesis Chip
Study of Al-doped ZnO Transparent Stimulus Electrode for Fully Implantable Retinal Prosthesis with Three-dimensionally Stacked Retinal Prosthesis Chip Open
To realize a three-dimensionally (3D) stacked retinal prosthesis chip having a large stimulus electrode area and a large photodiode area, the fundamental properties of an Al-doped ZnO transparent stimulus electrode were investigated in det…
View article: Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration
Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration Open
Plasma- and water-assisted oxide-oxide thermocompression direct bonding for a self-assembly based multichip-to-wafer (MCtW) 3D integration approach was demonstrated. The bonding yields and bonding strengths of the self-assembled chips obta…
View article: 3D Interconnect Technologies Based on TSV and Fine-Pitch Electrode
3D Interconnect Technologies Based on TSV and Fine-Pitch Electrode Open
View article: Table of Contents
Table of Contents Open
View article: Vertical-cavity surface-emitting laser chip bonding by surface-tension-driven self-assembly for optoelectronic heterogeneous integration
Vertical-cavity surface-emitting laser chip bonding by surface-tension-driven self-assembly for optoelectronic heterogeneous integration Open
Twelve-channel vertical-cavity surface-emitting laser (12-ch VCSEL) chips are heterogeneously self-assembled on Si and glass wafers using water surface tension as a driving force. The VCSEL chips have a high length-to-width aspect ratio, t…