Microelectronics
View article: Impact of Spatial Configuration on Fluid Flow through a Microchannel with Fin Pin Array
Impact of Spatial Configuration on Fluid Flow through a Microchannel with Fin Pin Array Open
Enhancing the efficiency of microheat exchangers with channel characteristic dimensions of up to 100 microns represents a critical challenge for advancing cooling systems in microelectronics. Approaches to address this challenge can be cat…
View article: Frequency and Dose Dependences of Electrophysical Properties of HDPE/ α-Fe3O4 Nanocomposites Modified by Gamma Rays
Frequency and Dose Dependences of Electrophysical Properties of HDPE/ α-Fe3O4 Nanocomposites Modified by Gamma Rays Open
The influence of gamma radiation of the Cobalt-60 radioactive source doses on the dielectric constant (ε'), dielectric loss (tan δ) and AC conductivity (σac) properties was studied for the unirradiated and irradiated HDPE/α-Fe3O4 nanocompo…
View article: Data Collection: Microstructure-driven electrical conductivity optimization in additively manufactured microscale copper interconnects
Data Collection: Microstructure-driven electrical conductivity optimization in additively manufactured microscale copper interconnects Open
As the microelectronics field pushes to increase device density through downscaling component dimensions, various novel micro- and nano-scale additive manufacturing technologies have emerged to expand the small scale design space. These te…
View article: Microelectronic modular system for sensor-integrating machine elements—model-based configuration and prototypical implementation of sensor-integrating bolts
Microelectronic modular system for sensor-integrating machine elements—model-based configuration and prototypical implementation of sensor-integrating bolts Open
In the Priority Program 2305 of the German Research Foundation, so-called Sensor-integrating Machine Elements (SiME) are to be developed. These are essentially highly standardised components with integrated microelectronics. This article p…
View article: Influence of Film Thickness on the Structure and Properties of Copper Thin Films Deposited on BaTiO3 Ceramics by DCMS and HiPIMS
Influence of Film Thickness on the Structure and Properties of Copper Thin Films Deposited on BaTiO3 Ceramics by DCMS and HiPIMS Open
In this study, we investigate the role of film thickness in modulating the properties of Cu films deposited on BaTiO3 ceramic substrates using direct current magnetron sputtering (DCMS) and high-power pulsed magnetron sputtering (HiPIMS). …
View article: Resistive Heating for Inducing Localized Crystal Growth in Organic Thin Film Devices
Resistive Heating for Inducing Localized Crystal Growth in Organic Thin Film Devices Open
Crystalline organic semiconductors are crucial for high‐performance optoelectronic devices due to their potential for high charge‐carrier mobility. Rubrene, in particular, exhibits exceptional hole transport in crystalline thin films; howe…
View article: Defect Engineering in β‐Bi <sub>2</sub> SeO <sub>5</sub> /Bi <sub>2</sub> O <sub>2</sub> Se Heterostructures for High‐Resolution Phototransistor Arrays
Defect Engineering in β‐Bi <sub>2</sub> SeO <sub>5</sub> /Bi <sub>2</sub> O <sub>2</sub> Se Heterostructures for High‐Resolution Phototransistor Arrays Open
Analogous to the pivotal SiO 2 /Si junction in modern electronics, the β‐Bi 2 SeO 5 /Bi 2 O 2 Se architecture has been demonstrated to enhance the performance of electronic devices. However, its potential to improve the optoelectronic prop…
View article: ENGINEERING LOCAL TIME THROUGH ENERGY GRADIENTS: FOUNDATIONS AND APPLICATIONS
ENGINEERING LOCAL TIME THROUGH ENERGY GRADIENTS: FOUNDATIONS AND APPLICATIONS Open
This series of articles presents a theoretical, experimental, and applied framework for controlling the local rate of time through the deliberate engineering of spatial energy gradients. Based on the foundational relation T(x)∝∣∣∇E(x)∣∣T(x…
View article: Selection Strategies for Flexible Pressure Sensor Electrode Materials Toward Ultrafast Response
Selection Strategies for Flexible Pressure Sensor Electrode Materials Toward Ultrafast Response Open
Achieving ultrafast response time is critical for pressure sensors in real‐time healthcare monitoring and hazard detection, yet enabling design strategies remain unestablished compared to other key metrics, such as sensitivity or pressure …
View article: Thermally conductive prepreg GFRP composites with boron nitride networks using a facile salt template method
Thermally conductive prepreg GFRP composites with boron nitride networks using a facile salt template method Open
View article: Sample preparation induced artefacts in soft SAC solders from uncooled and cooled Argon ion milling
Sample preparation induced artefacts in soft SAC solders from uncooled and cooled Argon ion milling Open
Complex combinations of various materials in microelectronic packages pose challenges for sample preparation. Reliable cross-sectional sample preparation is critical for microstructural analysis, especially when utilising low-melting Sn-Ag…
View article: Multimaterial 3D Printing of Soft and Stretchable Electronics
Multimaterial 3D Printing of Soft and Stretchable Electronics Open
The development of soft and stretchable microelectronics is critical for next‐generation flexible devices, biointerfaces, and microscale energy systems due to their unique electrical and mechanical properties. However, current 3D printing …
View article: GaneStat—A comprehensive design and modular analysis of portable, low-cost, and high-accuracy potentiostat
GaneStat—A comprehensive design and modular analysis of portable, low-cost, and high-accuracy potentiostat Open
Electrochemical research has been developing with the advancement of laboratory equipment and sophisticated technologies. One of which is the portable potentiostat, which has been utilized to analyze various samples and help characterize t…
View article: EUV-induced low pressure hydrogen and H <sub>2</sub> /Sn plasmas
EUV-induced low pressure hydrogen and H <sub>2</sub> /Sn plasmas Open
The continuing decrease in feature size in microelectronics fabrication has been enabled by a progressive decrease in the wavelengths for photolithography. The recent deployment of extreme ultra-violet (EUV) lithography systems with photon…
View article: High Density Hybridisation Using ENIG Bumping and Anisotropic Conductive Films
High Density Hybridisation Using ENIG Bumping and Anisotropic Conductive Films Open
Fine-pitch hybridisation processes are essential for next-generation pixel detectors and high-density microelectronic assemblies. Conventional bump-bonding techniques, although reliable, remain costly and difficult to implement for single-…
View article: High Density Hybridisation Using ENIG Bumping and Anisotropic Conductive Films
High Density Hybridisation Using ENIG Bumping and Anisotropic Conductive Films Open
Fine-pitch hybridisation processes are essential for next-generation pixel detectors and high-density microelectronic assemblies. Conventional bump-bonding techniques, although reliable, remain costly and difficult to implement for single-…
View article: Sticking to Green: Sustainable Solutions for Next-Generation Microelectronic Packaging with Plant-Derived and Bacterial Adhesives
Sticking to Green: Sustainable Solutions for Next-Generation Microelectronic Packaging with Plant-Derived and Bacterial Adhesives Open
View article: Multiscale Modeling of Thermo–Electro–Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis
Multiscale Modeling of Thermo–Electro–Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis Open
Ruggedized computers are the core of modern communication, guidance, control, and data-processing systems, and typically operate under extreme environmental conditions. However, under extreme service conditions such as temperature cycling,…
View article: Atomic-scale strain-confined ferroelectricity in fluorite hafnium dioxide
Atomic-scale strain-confined ferroelectricity in fluorite hafnium dioxide Open
HfO 2 -based ferroelectrics hold exceptional promise for next-generation microelectronics, offering robust ferroelectricity down to the nanoscale while maintaining compatibility with CMOS technology. However, stabilization of th…
View article: IIT-CNR OFET transistor characterisation sweeps
IIT-CNR OFET transistor characterisation sweeps Open
OFET transistor characterisation sweeps Sweeps of organic thin-film transistors, N- and P- types, from a series of batches fabricated in collaboration between Italian Institute of Technology, Center for Robotics and Intelligent Systems (Ge…
View article: IIT-CNR OFET transistor characterisation sweeps
IIT-CNR OFET transistor characterisation sweeps Open
OFET transistor characterisation sweeps Sweeps of organic thin-film transistors, N- and P- types, from a series of batches fabricated in collaboration between Italian Institute of Technology, Center for Robotics and Intelligent Systems (Ge…
View article: 50 years of nanomechanics: Scale-bridging mechanistic insights through the looking glass
50 years of nanomechanics: Scale-bridging mechanistic insights through the looking glass Open
Historical and recent advances in the field of nanomechanics, ranging from the early development of nanoindentation to recent advances in artificial intelligence- and machine learning-based characterization and modeling are covered in this…
View article: Tapered Cladding Design for Monolithic Waveguide–Photodetector Coupling in Si-Based Integrated Photonics
Tapered Cladding Design for Monolithic Waveguide–Photodetector Coupling in Si-Based Integrated Photonics Open
Silicon photonics offers a powerful route to leverage existing microelectronics infrastructure to enhance performance and enable new applications in data processing and sensing. Among the available material platforms, silicon nitride (Si3N…
View article: High Thermal Conductivity Porous Organic Polymers with Low Permittivity via Desolvation‐Induced Self‐Assembly
High Thermal Conductivity Porous Organic Polymers with Low Permittivity via Desolvation‐Induced Self‐Assembly Open
Miniaturization of microelectronic devices demand organic dielectric polymers with ultralow permittivity ( k < 2.0) and high thermal conductivity (λ > 1.0 W·m −1 ·K −1 ) to mitigate signal delay and thermal accumulation. However, organic p…
View article: Industry Outlook: Microelectronics Market
Industry Outlook: Microelectronics Market Open
The global Microelectronics Market was valued at USD 516.68 billion in 2024 and is projected to reach USD 562.41 billion by 2025, eventually attaining USD 859.40 billion by 2030, growing at a CAGR of 8.85% from 2025 to 2030. The market exp…
View article: Industry Outlook: Microelectronics Market
Industry Outlook: Microelectronics Market Open
The global Microelectronics Market was valued at USD 516.68 billion in 2024 and is projected to reach USD 562.41 billion by 2025, eventually attaining USD 859.40 billion by 2030, growing at a CAGR of 8.85% from 2025 to 2030. The market exp…
View article: Quantification of Volatile Compounds in Mixtures Using a Single Thermally Modulated MOS Gas Sensor with PCA–ANN Data Processing
Quantification of Volatile Compounds in Mixtures Using a Single Thermally Modulated MOS Gas Sensor with PCA–ANN Data Processing Open
Recent research efforts have focused on improving the performance of metal-oxide semiconductor (MOS) gas sensors through their thermal modulation using integrated heaters. This approach allows us to enhance the selectivity of measurements;…
View article: Microelectronics Market
Microelectronics Market Open
The global Microelectronics Market, valued at $516.68B in 2024, is projected to reach $859.40B by 2030 (CAGR 8.85%), driven by the rising demand for consumer electronics, EVs, and industrial automation. Market growth is further fueled by I…
View article: Microelectronics Market
Microelectronics Market Open
The global Microelectronics Market, valued at $516.68B in 2024, is projected to reach $859.40B by 2030 (CAGR 8.85%), driven by the rising demand for consumer electronics, EVs, and industrial automation. Market growth is further fueled by I…
View article: Flexible circuits engineered for complex and extreme environments
Flexible circuits engineered for complex and extreme environments Open
Driven by the rising demand for mechanical adaptability, structural reconfigurability, and multifunctional integration, flexible circuits are gaining increasing importance in advanced electronic systems. They serve as key enablers for next…