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Universal Soldering of Lithium and Sodium Alloys on Various Substrates for Batteries Open
The high theoretical specific capacity of lithium (Li) metal and the nonflammability of solid‐state electrolytes (SSEs) make the solid‐state Li metal battery a promising option to develop safe batteries with high energy density. To make th…
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Direct Printing of 1-D and 2-D Electronically Conductive Structures by Molten Lead-Free Solder Open
This study aims to determine the effects of appropriate experimental parameters on the thermophysical properties of molten micro droplets, Sn-3Ag-0.5Cu solder balls with an average droplet diameter of 50 μm were prepared. The inkjet printi…
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Reliability issues of lead-free solder joints in electronic devices Open
Electronic products are evolving towards miniaturization, high integration, and multi-function, which undoubtedly puts forward higher requirements for the reliability of solder joints in electronic packaging. Approximately 70% of failure i…
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3D Printed Waveguide Slot Array Antennas Open
Waveguide slot array antennas can have high gain, since the power distribution network (waveguide) has low loss, enabling a large aperture size. Rapid response to requirements for frequency, gain, and skew angle inspired a search for an al…
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Brazing filler metals Open
Brazing is a 5000-year-old joining process which still meets advanced joining challenges today. In brazing, components are joined by heating above the melting point of a filler metal placed between them; on solidification a joint is formed…
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Structure and properties of Sn-Cu lead-free solders in electronics packaging Open
With the development of lead-free solders in electronic packaging, Sn-Cu lead-free solder has attracted wide attention due to its excellent comprehensive performance and low cost. In this article, we present recent developments in Sn-Cu le…
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Materials modification of the lead-free solders incorporated with micro/nano-sized particles: A review Open
As to promote the performance of the solder joints applied to electronics industry, the researchers take advantage of micro/nano-sized particles or another element coated on nanoparticles to be incorporated into the solder paste or flux an…
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Reversible polymer-gel transition for ultra-stretchable chip-integrated circuits through self-soldering and self-coating and self-healing Open
Integration of solid-state microchips into soft-matter, and stretchable printed electronics has been the biggest challenge against their scalable fabrication. We introduce, Pol-Gel, a simple technique for self-soldering, self-encapsulation…
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Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints Open
Sn-Bi solder with different Bi content can realize a low-to-medium-to-high soldering process. To obtain the effect of Bi content in Sn-Bi solder on the microstructure of solder, interfacial behaviors in solder joints with Cu and the joints…
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Electrochemical migration of Sn and Sn solder alloys: a review Open
The schematic diagram of electrochemical migration of Sn solder alloys joints.
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A Review on Recent Advances in Transient Liquid Phase (TLP) Bonding for Thermoelectric Power Module Open
In this study, the authors have reviewed recent advances on the transient liquid phase (TLP) bonding technology for various applications especially power module packaging in view of the recent increasing demand for the production of vehicl…
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Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics Open
Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi solder alloys attract much attention from industries for flexible p…
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The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface Open
In recent years, in order to adapt to the trend of low-temperature assembly and integration, low-temperature hybrid solders with multiple elements added to the tin solder matrix have been investigated. In this regard, the morphology and si…
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Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review Open
With the development of microelectronic packaging and increasingly specific service environment of solder joints, much stricter requirements have been placed on the properties of lead-free solders. On account of small size effect and high …
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Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology Open
Package-on-Package (PoP) is a popular technology for fabricating chipsets of accelerated processing units. However, the coefficient of thermal expansion mismatch between Si chips and polymer substrates induces thermal warpage during the re…
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Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics Open
The quantity and variety of parameters involved in the failure evolutions in solder joints under a thermo-mechanical process directs the reliability assessment of electronic devices to be frustratingly slow and expensive. To tackle this ch…
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Forming mechanism and growth of Kirkendall voids of Sn/Cu joints for electronic packaging: A recent review Open
For the common Cu-Sn interconnection system in microelectronics packaging, a significant concern is the sporadic interfacial void formation within the Cu–Sn interface and intermetallic compound (IMC) layer during the service. The existence…
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Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies Open
The electronic industry faces a number of issues as a result of the rapid miniaturization of electronic products and the expansion of application areas, with the reliability of electronic packaging materials playing a significant role. Mor…
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Review of microstructure and properties of low temperature lead-free solder in electronic packaging Open
Low temperature solder (In-based, Sn-Bi, Sn-Zn) has great advantages in aerospace and through-hole technology assemblies in IBM mainframe due to its unique low temperature characteristics. The review evaluates the effects of alloying eleme…
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Nucleation and growth of Ag3Sn in Sn-Ag and Sn-Ag-Cu solder alloys Open
Large Ag3Sn plates in solder joints can affect the reliability of electronics, however, the factors affecting their nucleation and morphology are not well understood. Here, the faceted solidification of Ag3Sn was studied as a function of m…
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Research Progress on Bonding Wire for Microelectronic Packaging Open
Wire bonding is still the most popular chip interconnect technology in microelectronic packaging and will not be replaced by other interconnect methods for a long time in the future. Au bonding wire has been a mainstream semiconductor pack…
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Solder joint failures under thermo-mechanical loading conditions – A review Open
Solder joints play a critical role in electronic devices by providing electrical, mechanical and thermal interconnections. These miniature joints are also the weakest links in an electronic device. Under severe thermal and mechanical loadi…
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Picoliter Solder Droplet Dispensing Open
A device based on ink-jet printing technology was used to produce and place \nmolten solder droplets, approximately 25-125pm in diameter, onto substrates. The \nadvantages of an ink-jet based system are direct production of metallic object…
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State of the Art of Lead-Free Solder Joint Reliability Open
The state of the art of lead-free solder joint reliability is investigated in this study. Emphasis is placed on the design for reliability (DFR) and reliability testing and data analysis. For DFR: (a) the Norton power creep constitutive eq…
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Soldered joints—an essential component of demountable high temperature superconducting fusion magnets Open
Demountable superconducting magnet coils would offer significant benefits to commercial nuclear fusion power plants. Whether large pressed joints or large soldered joints provide the solution for demountable fusion magnets, a critical comp…
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Intermetallics Formation and Their Effect on Mechanical Properties of Al-Si-X Alloys Open
This study focuses on primary impurities, called intermetallics, in the microstructure of Al-Si-X alloys, their formation, effects and treatments to eliminate or ameliorate their deleterious effects. Intermetallic compounds are usually for…
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The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering Open
This paper elucidated the effects of the Bi element (0 wt%, 0.5 wt% and 1.5 wt%) on the microstructure, electrical, wettability and mechanical properties of the Sn-0.7Cu-0.05Ni as a high strength solder. Besides using the conventional cros…
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From cells to laminate: probing and modeling residual stress evolution in thin silicon photovoltaic modules using synchrotron X‐ray micro‐diffraction experiments and finite element simulations Open
Fracture of silicon crystalline solar cells has recently been observed in increasing percentages especially in solar photovoltaic (PV) modules involving thinner silicon solar cells (<200 μm). Many failures due to fracture have been reporte…
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A critical review of constitutive models for solders in electronic packaging Open
Owing to their superior electrical, thermal, and mechanical properties, solder joints are the most widely used interconnection materials in electronic product packaging. Because the failure of the whole electronic packaging is often induce…
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A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints Open
This paper presents a multi-scale modelling approach to investigate the underpinning mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5Cu (wt%, SAC305) solder joints of a Ball Grid Array (BGA) board assembly subject…