Thermal grease
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Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management Open
Thermal management is the most critical technology challenge for modern electronics. Recent key materials innovation focuses on developing advanced thermal interface of electronic packaging for achieving efficient heat dissipation. Here, f…
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High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material Open
Compression studies on three-dimensional foam-like graphene and h-BN (3D-C and 3D-BN) revealed their high cross-plane thermal conductivity (62-86 W m-1 K-1) and excellent surface conformity, characteristics essential for thermal management…
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Microstructured BN Composites with Internally Designed High Thermal Conductivity Paths for 3D Electronic Packaging Open
Miniaturized and high‐power‐density 3D electronic devices pose new challenges on thermal management. Indeed, prompt heat dissipation in electrically insulating packaging is currently limited by the thermal conductivity achieved by thermal …
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Review of high thermal conductivity polymer dielectrics for electrical insulation Open
Traditional insulation material is thermally insulating and has a low thermal conductivity. The miniaturisation and higher power of electrical devices would generate lots of heat, which have created new challenges to safe and stable operat…
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Materials Discovery and Properties Prediction in Thermal Transport via Materials Informatics: A Mini Review Open
There has been increasing demand for materials with functional thermal properties, but traditional experiments and simulations are high-cost and time-consuming. The emerging discipline, materials informatics, is an effective approach that …
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Recent Advances in Thermal Interface Materials for Thermal Management of High-Power Electronics Open
With the increased level of integration and miniaturization of modern electronics, high-power density electronics require efficient heat dissipation per unit area. To improve the heat dissipation capability of high-power electronic systems…
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Noncuring Graphene Thermal Interface Materials for Advanced Electronics Open
Development of next‐generation thermal interface materials (TIMs) with high thermal conductivity is important for thermal management and packaging of electronic devices. The synthesis and thermal conductivity measurements of noncuring ther…
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Recent Advances in Thermal Interface Materials Open
In recent years, miniaturization and integration have become the development trends of electronic devices.With the power of electronic devices continuing to increase, the amount of heat generated is sharply increasing.Thermal interface mat…
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Remarkably enhanced thermal transport based on a flexible horizontally-aligned carbon nanotube array film Open
It has been more than a decade since the thermal conductivity of vertically aligned carbon nanotube (VACNT) arrays was reported possible to exceed that of the best thermal greases or phase change materials by an order of magnitude. Despite…
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High thermal conductive copper/diamond composites: state of the art Open
Copper/diamond composites have drawn lots of attention in the last few decades, due to its potential high thermal conductivity and promising applications in high-power electronic devices. However, the bottlenecks for their practical applic…
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Thermal Management of Concentrated Multi-Junction Solar Cells with Graphene-Enhanced Thermal Interface Materials Open
We report results of experimental investigation of temperature rise in concentrated multi-junction photovoltaic solar cells with graphene-enhanced thermal interface materials. Graphene and few-layer graphene fillers, produced by a scalable…
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Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions Open
Effective thermal management of traction-drive power electronics is critical to the advancement of electric-drive vehicles (EDVs) and is necessary for increasing power density and improving reliability. Replacing traditional silicon device…
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Three-Dimensional Heterostructured Reduced Graphene Oxide-Hexagonal Boron Nitride-Stacking Material for Silicone Thermal Grease with Enhanced Thermally Conductive Properties Open
The thermally conductive properties of silicone thermal grease enhanced by hexagonal boron nitride (hBN) nanosheets as a filler are relevant to the field of lightweight polymer-based thermal interface materials. However, the enhancements a…
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Enhanced Thermal Transport Properties of Epoxy Resin Thermal Interface Materials Open
Enhanced Thermal Transport Properties of
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Vertically aligned carbon nanotube arrays as a thermal interface material Open
Vertically aligned carbon nanotube (VACNT) arrays are considered a promising candidate for a thermal interface material (TIM) due to their good stability, high thermal conductivity, and desirable mechanical properties. In the last few deca…
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Theoretical and experimental evaluation of thermal interface materials and other influencing parameters for thermoelectric generator system Open
Thermal interface resistance of Thermoelectric Generator (TEG) plays a vital role in power production. Improving surface finish of contact surfaces, applying pressure between the contact surfaces and use of Thermal Interface Material (TIM)…
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Expanded Graphite/Paraffin/Silicone Rubber as High Temperature Form-stabilized Phase Change Materials for Thermal Energy Storage and Thermal Interface Materials Open
In this work, expanded graphite/paraffin/silicone rubber composite phase-change materials (PCMs) were prepared by blending the expanded graphite (EG), paraffin wax (PW) and silicone rubber (SR) matrix. It has been shown that PW fully penet…
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Graphene-Based Thermal Interface Materials: An Application-Oriented Perspective on Architecture Design Open
With the increasing power density of electrical and electronic devices, there has been an urgent demand for the development of thermal interface materials (TIMs) with high through-plane thermal conductivity for handling the issue of therma…
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Thermal performance of a 3D printed lattice-structure heat sink packaging phase change material Open
Thermal storage technology is becoming more and more significant with the increase of high-power equipment in space applications. In this paper, 3D printing technology and Phase Change Material (PCM) were combined into a Thermal Energy Sto…
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Regulatable Orthotropic 3D Hybrid Continuous Carbon Networks for Efficient Bi-Directional Thermal Conduction Open
Vertically oriented carbon structures constructed from low-dimensional carbon materials are ideal frameworks for high-performance thermal interface materials (TIMs). However, improving the interfacial heat-transfer efficiency of vertically…
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Reduced Graphene Oxide Embedded with MQ Silicone Resin Nano-Aggregates for Silicone Rubber Composites with Enhanced Thermal Conductivity and Mechanical Performance Open
With developments of the electronics industry, more components are being included in electronic devices, which has led to challenges in thermal management. Using reduced graphene oxide embedded with MQ silicone resin (RGO/MQ) nano-aggregat…
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High Thermal Conductivity of Sandwich‐Structured Flexible Thermal Interface Materials Open
Thermal interfaces are vital for effective thermal management in modern electronics, especially in the emerging fields of flexible electronics and soft robotics that impose requirements for interface materials to be soft and flexible in ad…
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An Analysis of the Thermal Interaction Between Components in Power Converter Applications Open
Accurately predicting the temperature of semiconductor devices is very important in the initial design of the power electronics converter. RC thermal models derived from the well-known methods have some ability to predict the temperature. …
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Advancements in SiC-Reinforced Metal Matrix Composites for High-Performance Electronic Packaging: A Review of Thermo-Mechanical Properties and Future Trends Open
With the advancement of semiconductor technology, chip cooling has become a major obstacle to enhancing the capabilities of power electronic systems. Traditional electronic packaging materials are no longer able to meet the heat dissipatio…
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3D Graphene-Nanowire “Sandwich” Thermal Interface with Ultralow Resistance and Stiffness Open
Despite the recent advancements of passive and active cooling solutions for electronics, interfaces between materials have generally become crucial barriers for thermal transport because of intrinsic material dissimilarity and surface roug…
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Noncured Graphene Thermal Interface Materials for High-Power Electronics: Minimizing the Thermal Contact Resistance Open
We report on experimental investigation of thermal contact resistance, RC, of the noncuring graphene thermal interface materials with the surfaces characterized by different degree of roughness, Sq. It is found that the thermal contact res…
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Non-Curing Thermal Interface Materials with Graphene Fillers for Thermal Management of Concentrated Photovoltaic Solar Cells Open
Temperature rise in multi-junction solar cells reduces their efficiency and shortens their lifetime. We report the results of the feasibility study of passive thermal management of concentrated multi-junction solar cells with the non-curin…
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A Novel Thermal Interface Material Composed of Vertically Aligned Boron Nitride and Graphite Films for Ultrahigh Through‐Plane Thermal Conductivity Open
The relentless drive toward miniaturization in microelectronic devices has sparked an urgent need for materials that offer both high thermal conductivity (TC) and excellent electrical insulation. Thermal interface materials (TIMs) possessi…
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Highly oriented BN-based TIMs with high through-plane thermal conductivity and low compression modulus Open
Large-scale production of highly oriented BN-based TIMs with high through-plane thermal conductivity and low compression modulus.
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Electrically Conductive Thermally Insulating Bi–Si Nanocomposites by Interface Design for Thermal Management Open
We demonstrate, both by experiments and by data informatics, an alternative strategy to achieve ultralow thermal conductivity in a dense solid. The interfacial thermal resistance (ITR) prediction of the machine learning model is implemente…